Senior Process Engineer

Looking for an opportunity to make an impact?

 

At Leidos, we deliver innovative solutions through the efforts of our diverse and talented people who are dedicated to our customers’ success. We empower our teams, contribute to our communities, and operate sustainably. Everything we do is built on a commitment to do the right thing for our customers, our people, and our community. Our Mission, Vision, and Values guide the way we do business.

 

Your greatest work is ahead!

 

We are seeking a motivated, hands-on Senior Process Engineer to play a key role in the development, implementation, and ramp-up of a new, state-of-the-art electronics manufacturing facility. This position offers an exciting opportunity to help shape manufacturing capabilities from the ground up, supporting facility layout development, equipment installation, commissioning, and process optimization across Surface Mount Technology (SMT), conformal coating, inspection, and automated test operations. The candidate will collaborate with Manufacturing Engineering, Industrial Engineering, Quality, Facilities, and Operations teams to establish efficient production workflows, optimize equipment utilization, and ensure seamless transitions from PCBA manufacturing through subassembly and final integration.

 

If this sounds like the kind of environment where you can thrive, keep reading!

 

Leidos Defense Systems Sector / Manufacturing provides a diverse portfolio of systems, solutions, and services covering land, sea, air, space, and cyberspace for customers worldwide. Solutions for Defense include enterprise and mission IT, large-scale intelligence systems, command and control, geospatial and data analytics, cybersecurity, logistics, training, and intelligence analysis and operations support. Our team is solving the world’s toughest security challenges for customers with “can’t fail” missions. To explore and learn more, click here!

 

Are you ready to make an impact? Apply and share your resume with us today!

 

Primary Responsibilities

• Co-lead and develop the manufacturing engineering team supporting PCBA assembly and complimentary processes such as selective solder, press-fit, conformal coating, board washing, etc..
• Drive continuous improvement projects to increase yield, throughput, and quality across the production line and specialized equipment.
• Monitor manufacturing KPIs (yield, first-pass yield, cycle time, scrap, escapes) to predict trends and drive proactive process changes.
• Perform DFM/DFA reviews on new product introductions and design changes, providing feedback to design engineering.
• Develop, document, and implement new manufacturing processes, work instructions, and process control plans.
• Identify, specify, and justify capital equipment for PCBA assembly, conformal coating, and related manufacturing processes.
• Support root cause analysis, corrective action, and disposition of manufacturing and quality nonconformances.
• Partner with quality, production control, and design teams to meet delivery schedules and customer quality requirements.
• Support quality engineering in process development and onsite audits
• Establish and monitor quality objectives of the production process
• Mentor and develop junior engineers in process development, root cause analysis,and mitigation

 

Basic Qualifications

• Requires a BS degree and 12-15 years of prior relevant experience or Masters with 10-12 years of prior relevant experience. In lieu of a degree, a highschool diploma/GED with 15 years of experience will be considered
• Must be a U.S. Citizen and be able to obtain/maintain a finalSecret Clearance
• Previous experience working in PCBA manufacturing and process development
• Strong background in Design for Manufacturability (DFM) to optimize product designs for production efficiency.
• Candidate must be a resident of Huntsville, Alabama or be willing to relocate to the Huntsville, Alabama area.

Preferred Qualifications

• Familiarity with IPC requirements (J-STD-001 and IPC-A-610)
• Experience with electronics used on launch vehicles, targets, or missile components such as PCBAs, cable harnesses, or electro-mechanical assemblies
• Experience with Costpoint Material Planning software and/or Windchill product lifecycle management software is a plus.
• Experience working in a mid to high volume manufacturing environment
• Ability to provide Rough Order of Magnitude (ROM) estimates, Basis of Estimate (BOE) documents, and other information to support proposal efforts
• Demonstrated success in implementing lean principles to reduce waste and improve efficiency.
• Experience in using Manufacturing Execution Systems (MES) such as Aegis Factory Logix is also a plus.
• Hands-on experience with PCBA automation equipment, such as SMT mounters, selective solder, board wash, press-fit, AOI, and general soldering equipment.

 

If you're looking for comfort, keep scrolling. At Leidos, we outthink, outbuild, and outpace the status quo — because the mission demands it. We're not hiring followers. We're recruiting the ones who disrupt, provoke, and refuse to fail. Step 10 is ancient history. We're already at step 30 — and moving faster than anyone else dares.

Original Posting:

November 6, 2026

For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.

Pay Range:

Pay Range $116,350.00 - $210,325.00

The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.